TMS-2000 uses an interferometric detection technique with a high-speed tunable laser to measure the flatness of the wafer up to 1nm repeatability for global, site and edge measurements of the wafer. Conventional wafer thickness mapping techniques struggle with accuracy issues when used in unstable environments involving extreme temperature changes and vibrations while the TMS-2000 has high environmental stability. Thanks to its high-speed measurement capability and compact size, the TMS-2000 can be used in various industrial fields involving in-line inspection.